FDZ197PZ Description
The FDZ197PZ lowers both PCB space and rDS by combining an innovative 1.5 V PowerTrench? technique with a state-of-the-art "fine pitch" WLCSP packaging process (on). This sophisticated WLCSP MOSFET represents a technological breakthrough in packaging, allowing it to combine superior thermal transfer properties, ultra-low profile packing, low gate charge, and low rDS (on).
FDZ197PZ Features
Max rDS(on) = 64 mΩ at VGS = -4.5 V, ID = -2.0 A
Max rDS(on) = 71 mmΩ at VGS = -2.5 V, ID= -2.0 A
Max rDS(on) = 79 mmΩ at VGS = -1.8 V, ID = -1.0 A
Max rDS(on) = 95 mmΩ at VGS = -1.5 V, ID = -1.0 A
Occupies only 1.5 mm2 of PCB area. Less than 50% of thearea of 2 x 2 BGA
Ultra-thin package: less than 0.65 mm height when mountedto PCB
HBM ESD protection level > 4.4 kV (Note 3)
RoHS Compliant
FDZ197PZ Applications
