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FDMS3660S

FDMS3660S

FDMS3660S

ON Semiconductor

FDMS3660S datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website

SOT-23

FDMS3660S Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Contact PlatingTin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-PowerTDFN
Number of Pins 8
Weight 171mg
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2009
Series PowerTrench®
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Subcategory FET General Purpose Power
Max Power Dissipation2.5W
Terminal FormFLAT
Base Part Number FDMS3660S
JESD-30 Code R-PDSO-F6
Number of Elements 2
Element ConfigurationDual
Operating ModeENHANCEMENT MODE
Power Dissipation2.5W
Case Connection DRAIN SOURCE
Turn On Delay Time7.7 ns
Power - Max 1W
FET Type 2 N-Channel (Dual) Asymmetrical
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 8m Ω @ 13A, 10V
Vgs(th) (Max) @ Id 2.7V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 1765pF @ 15V
Current - Continuous Drain (Id) @ 25°C 30A 60A
Gate Charge (Qg) (Max) @ Vgs 29nC @ 10V
Turn-Off Delay Time 19 ns
Continuous Drain Current (ID) 30A
Threshold Voltage 1.5V
Gate to Source Voltage (Vgs) 12V
Drain Current-Max (Abs) (ID) 13A
Drain to Source Breakdown Voltage 30V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs 1.5 V
Feedback Cap-Max (Crss) 70 pF
Height 1.1mm
Length 5mm
Width 5.9mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:4205 items

Pricing & Ordering

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FDMS3660S Product Details

FDMS3660S Description

The device includes two dedicated N-channel MOSFET in a dual PQFN package. The switch nodes are connected internally for easy placement and wiring of synchronous step-down converters. Control MOSFET (Q1) and synchronous synchronous FET (Q2) are designed to provide optimal power efficiency.


FDMS3660S Features


Q1: N?Channel

? Max rDS(on) = 8 m at VGS = 10 V, ID = 13 A

? Max rDS(on) = 11 m at VGS = 4.5 V, ID = 11 A

Q2: N?Channel

? Max rDS(on) = 1.8 m at VGS = 10 V, ID = 30 A

? Max rDS(on) = 2.2 m at VGS = 4.5 V, ID = 27 A

? Low Inductance Packaging Shortens Rise/Fall Times, Resulting in

Lower Switching Losses

? MOSFET Integration Enables Optimum Layout for Lower Circuit

Inductance and Reduced Switch Node Ringing

? These Devices are Pb?Free and are RoHS Compliant


FDMS3660S Applications


? Computing

? Communications

? General Purpose Point of Load

? Notebook VCORE





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