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FDME1034CZT

FDME1034CZT

FDME1034CZT

ON Semiconductor

FDME1034CZT datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website

SOT-23

FDME1034CZT Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-UFDFN Exposed Pad
Number of Pins 6
Weight 25.2mg
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2017
Series PowerTrench®
JESD-609 Code e4
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Additional FeatureESD PROTECTION
Subcategory Other Transistors
Max Power Dissipation1.4W
Number of Elements 2
Element ConfigurationDual
Operating ModeENHANCEMENT MODE
Power Dissipation1.3W
Case Connection DRAIN
Power - Max 600mW
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 66m Ω @ 3.4A, 4.5V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 300pF @ 10V
Current - Continuous Drain (Id) @ 25°C 3.8A 2.6A
Gate Charge (Qg) (Max) @ Vgs 4.2nC @ 4.5V
Rise Time4.8ns
Drain to Source Voltage (Vdss) 20V
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Fall Time (Typ) 16 ns
Turn-Off Delay Time 33 ns
Continuous Drain Current (ID) 3.8A
Threshold Voltage 700mV
Gate to Source Voltage (Vgs) 8V
Drain Current-Max (Abs) (ID) 3.4A
Drain to Source Breakdown Voltage -20V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs 700 mV
Feedback Cap-Max (Crss) 40 pF
Height 500μm
Length 1.6mm
Width 1.6mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
In-Stock:8932 items

Pricing & Ordering

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FDME1034CZT Product Details

FDME1034CZT Description


The device is a single package solution designed for DC/DC' switch 'MOSFET in cellular phones and other super-portable applications. It has independent N-channel and P-channel MOSFET and low on-state resistance to minimize on-loss. The gate charge of each MOSFET is also minimized to allow high frequency switching directly from the control device. The MicroFET 1.6x1.6 ultra-thin package provides excellent thermal performance with its physical size, making it ideal for switching and linear mode applications.


FDME1034CZT Features


Q1: N?Channel

? Max rDS(on) = 66 m at VGS = 4.5 V, ID = 3.4 A

? Max rDS(on) = 86 m at VGS = 2.5 V, ID = 2.9 A

? Max rDS(on) = 113 m at VGS = 1.8 V, ID = 2.5 A

? Max rDS(on) = 160 m at VGS = 1.5 V, ID = 2.1 A

Q2: P?Channel

? Max rDS(on) = 142 m at VGS = ?4.5 V, ID = ?2.3 A

? Max rDS(on) = 213 m at VGS = ?2.5 V, ID = ?1.8 A

? Max rDS(on) = 331 m at VGS = ?1.8 V, ID = ?1.5 A

? Max rDS(on) = 530 m at VGS = ?1.5 V, ID = ?1.2 A

? Low Profile: 0.55 mm Maximum in the New Package MicroFET

1.6x1.6 Thin

? Free from Halogenated Compounds and Antimony Oxides

? HBM ESD Protection Level > 1600 V (Note 3)

? This Device is Pb?Free and is RoHS Compliant


FDME1034CZT Applications


? DC?DC Conversion

? Level Shifted Load Switch






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