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FDC6304P

FDC6304P

FDC6304P

ON Semiconductor

FDC6304P datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website

SOT-23

FDC6304P Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SOT-23-6 Thin, TSOT-23-6
Number of Pins 6
Weight 36mg
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Resistance 1.1Ohm
Terminal Finish Tin (Sn)
Subcategory Other Transistors
Voltage - Rated DC -25V
Max Power Dissipation700mW
Terminal FormGULL WING
Current Rating-460mA
Number of Elements 2
Element ConfigurationDual
Operating ModeENHANCEMENT MODE
Power Dissipation900mW
Turn On Delay Time7 ns
FET Type 2 P-Channel (Dual)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 1.1 Ω @ 500mA, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 62pF @ 10V
Current - Continuous Drain (Id) @ 25°C 460mA
Gate Charge (Qg) (Max) @ Vgs 1.5nC @ 4.5V
Rise Time8ns
Drain to Source Voltage (Vdss) 25V
Fall Time (Typ) 8 ns
Turn-Off Delay Time 55 ns
Continuous Drain Current (ID) -460mA
Threshold Voltage -860mV
Gate to Source Voltage (Vgs) 8V
Drain to Source Breakdown Voltage -25V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:2253 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.647702$0.647702
10$0.611040$6.1104
100$0.576453$57.6453
500$0.543823$271.9115
1000$0.513041$513.041

FDC6304P Product Details

FDC6304P Description

These P-channel enhanced mode field effect transistors are produced using on Semiconductor's proprietary high cell density. DMOS technology. This very high-density process is tailor-made to minimize on-resistance under low gate driving conditions. The device is designed for battery-powered applications such as laptops and mobile phones. The device has excellent on-resistance even at a gate drive voltage as low as 2.5 volts.

FDC6304P Features


-25V.-0.46 Acontinuous-1.0APeak.RpsiON=1.5|[email protected]=-2.7V RD8ION=1.1|[email protected]=-4.5V.

Very low level gate drive requirements allowing direc! operation in 3V circuits. Vcs<1.5V. Gate-Source Zener for ESD ruggedness.>6kV Human Body Model.

FDC6304P Applications


battery-powered applications





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