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XPC850DEZT66BUR2

XPC850DEZT66BUR2

XPC850DEZT66BUR2

NXP USA Inc.

Microprocessor MPC8xx Series PC850 256-BGA

SOT-23

XPC850DEZT66BUR2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case 256-BGA
Operating Temperature0°C~95°C TA
PackagingTape & Reel (TR)
Series MPC8xx
Published 2004
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS StatusNon-RoHS Compliant
In-Stock:1201 items

XPC850DEZT66BUR2 Product Details

XPC850DEZT66BUR2 Overview


Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 256-BGA. High reliability is achieved using advanced packaging method Tape & Reel (TR). 1 Core 32-Bit cores/Bus width are present in the CPU. Identify the operating temperature around 0°C~95°C TA. In the MPC8xx series, it is found. A total of DRAM RAM controllers are used by this CPU. The microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART for better service. At 3.3V, the CPU runs its I/O. Search PC850 for variants of the embedded microprocessor.

XPC850DEZT66BUR2 Features




XPC850DEZT66BUR2 Applications


There are a lot of NXP USA Inc.
XPC850DEZT66BUR2 Microprocessor applications.


  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio

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