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MC33PF8100CEES

MC33PF8100CEES

MC33PF8100CEES

NXP USA Inc.

2.5V~5.5V Specialized Power Management ICs

SOT-23

MC33PF8100CEES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature-40°C~105°C TA
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
In-Stock:802 items

Pricing & Ordering

QuantityUnit PriceExt. Price
260$6.74900$1754.74

MC33PF8100CEES Product Details

MC33PF8100CEES Overview


The way of Tray is acceptable for shipping the power management.It is packaged the power management in 56-VFQFN Exposed Pad for convenient transportation.The Surface Mount, Wettable Flank mounting method is universal for easy adaptation.The power management is targeted at High Performance i.MX 8, S32x Processor Based and other applications.The operating temperature of the power management ic should be set to -40°C~105°C TA to avoid mal-function.For its operation, the power management uses 2.5V~5.5V voltage.

MC33PF8100CEES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA

MC33PF8100CEES Applications


There are a lot of NXP USA Inc. MC33PF8100CEESPower Management applications.

  • Wireless routers
  • Termination Voltage
  • DDR-II Termination Voltage
  • SSTL-3 Termination
  • Office Electronics
  • Debug
  • System Thermal for Servers
  • Server Backplane Systems
  • Automotive Digital Cluster
  • Servers

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