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MC33FS6520LAER2

MC33FS6520LAER2

MC33FS6520LAER2

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6520LAER2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2017
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:988 items

Pricing & Ordering

QuantityUnit PriceExt. Price

MC33FS6520LAER2 Product Details

MC33FS6520LAER2 Overview


Using Tape & Reel (TR) as a shipping the power management path is acceptable.packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.The Surface Mount mounting method facilitates easy adaptation.The power management is designed for use with applications at System Basis Chip .Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.As a result, this power management is powered by 1V~5V voltage.

MC33FS6520LAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6520LAER2 Applications


There are a lot of NXP USA Inc. MC33FS6520LAER2Power Management applications.

  • Digital Cores
  • DDR-II Termination Voltage
  • Measurement of Point Voltages
  • LP2996A: DDR3
  • Modules With Remote-Sense Capability
  • Automotive display
  • Projection Mapping
  • Portable Systems
  • SmartPhones
  • Cordless Phone Base Station

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