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MC33FS6502CAER2

MC33FS6502CAER2

MC33FS6502CAER2

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6502CAER2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2017
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:651 items

Pricing & Ordering

QuantityUnit PriceExt. Price

MC33FS6502CAER2 Product Details

MC33FS6502CAER2 Overview


Tape & Reel (TR) is acceptable for shipping the power management.A convenient transport package is provided in 48-LQFP Exposed Pad .The Surface Mount mounting method allows for easy adaptation.Applications targeting this power management include System Basis Chip and others.Ideally, the operating temperature of the power management ic should be set to -40°C~125°C to avoid any malfunctions.The power management operates at 1V~5V volts.

MC33FS6502CAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6502CAER2 Applications


There are a lot of NXP USA Inc. MC33FS6502CAER2Power Management applications.

  • HSTL Termination
  • Hearing Aids
  • Medical
  • Chromebook
  • Applications Processors
  • DDR Termination Voltage WHITE SPACE
  • System Health Prognostics
  • Equipment Run-Off of Battery Backup
  • Servers
  • Motherboard

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