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MC33PF8200EMES

MC33PF8200EMES

MC33PF8200EMES

NXP USA Inc.

2.5V~5.5V Specialized Power Management ICs

SOT-23

MC33PF8200EMES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 2 Weeks
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature-40°C~105°C TA
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V
Analog IC - Other Type POWER SUPPLY MANAGEMENT CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:542 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$12.92000$12.92
500$12.7908$6395.4
1000$12.6616$12661.6
1500$12.5324$18798.6
2000$12.4032$24806.4
2500$12.274$30685

MC33PF8200EMES Product Details

MC33PF8200EMES Overview


The way of Tray is acceptable for shipping the power management.Packing in 56-VFQFN Exposed Pad makes transportation convenient.An easy-to-adapt universal mounting system is provided by Surface Mount, Wettable Flank .At High Performance i.MX 8, S32x Processor Based and other applications, this power management is targeted.Ensure that the operating temperature of the power management ic is set to -40°C~105°C TA in order to prevent malfunctions.As a result, this power management is powered by 2.5V~5.5V voltage.It has received much praise because it is a POWER SUPPLY MANAGEMENT CIRCUIT analog integrated circuit.

MC33PF8200EMES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC

MC33PF8200EMES Applications


There are a lot of NXP USA Inc. MC33PF8200EMESPower Management applications.

  • Tablets
  • Automotive Navigation Systems
  • Digital Cores
  • FPGA
  • Office Electronics
  • Portable Systems
  • Cordless Phone Base Station
  • Set-Top-Box
  • Hand-Held Systems
  • Automotive head unit

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