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MC33FS6500LAE

MC33FS6500LAE

MC33FS6500LAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6500LAE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature-40°C~125°C
PackagingTray
Published 2017
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:1341 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$7.24000$7.24
10$6.53600$65.36
25$6.23200$155.8
250$5.16800$1292
500$4.71200$2356

MC33FS6500LAE Product Details

MC33FS6500LAE Overview


The way of Tray is acceptable for shipping the power management.The package is conveniently packaged the power management in 48-LQFP Exposed Pad .The Surface Mount mounting method allows for easy adaptation.The power management is designed for use with applications at System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~125°C in order to prevent malfunction.The power management works at 1V~5V voltage.

MC33FS6500LAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6500LAE Applications


There are a lot of NXP USA Inc. MC33FS6500LAEPower Management applications.

  • Tablet PCs
  • LP2996A: DDR3
  • Data Storage
  • SSTL-3
  • Automotive Infotainment
  • Docking station
  • Equipment Run-Off of Battery Backup
  • Telecommunication
  • Industrial applications
  • Networking Router

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