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MC33FS6522LAE

MC33FS6522LAE

MC33FS6522LAE

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6522LAE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature-40°C~125°C
PackagingTray
Published 2017
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:668 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$9.00000$9
10$8.12700$81.27
25$7.74920$193.73
250$6.42600$1606.5
500$5.85900$2929.5

MC33FS6522LAE Product Details

MC33FS6522LAE Overview


The way of Tray is acceptable for shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is a universal mounting method that is easy to adapt.It targets applications such as System Basis Chip and others.Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.For its operation, the power management uses 1V~5V voltage.

MC33FS6522LAE Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6522LAE Applications


There are a lot of NXP USA Inc. MC33FS6522LAEPower Management applications.

  • Measurement of Point Voltages
  • Applications Processors
  • Portable Systems
  • Tablets
  • Electronic Test Equipment
  • Telecommunication
  • Environmental Test
  • LTE modem
  • SSTL-3 Termination
  • Hearing Aids

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