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MC33FS4500CAER2

MC33FS4500CAER2

MC33FS4500CAER2

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS4500CAER2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2017
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:940 items

Pricing & Ordering

QuantityUnit PriceExt. Price

MC33FS4500CAER2 Product Details

MC33FS4500CAER2 Overview


Tape & Reel (TR) is acceptable for shipping the power management.packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.The Surface Mount mounting method is universal for easy adaptation.Applications targeting this power management include System Basis Chip and others.A temperature setting of -40°C~125°C is recommended to avoid malfunctions.The power management runs on 1V~5V voltage.

MC33FS4500CAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS4500CAER2 Applications


There are a lot of NXP USA Inc. MC33FS4500CAER2Power Management applications.

  • Hearing Aids
  • LP2996-N: DDR1 Termination Voltage
  • Tablets
  • System Health Prognostics
  • Wireless routers
  • FPGA
  • Networking Equipment
  • Modules With Remote-Sense Capability
  • Motherboard
  • Radar system ECU

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