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MC33FS6512LAER2

MC33FS6512LAER2

MC33FS6512LAER2

NXP USA Inc.

1V~5V Specialized Power Management ICs

SOT-23

MC33FS6512LAER2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Mounting Type Surface Mount
Package / Case 48-LQFP Exposed Pad
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2017
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications System Basis Chip
Voltage - Supply 1V~5V
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 40
Telecom IC Type INTERFACE CIRCUIT
RoHS StatusROHS3 Compliant
In-Stock:642 items

Pricing & Ordering

QuantityUnit PriceExt. Price

MC33FS6512LAER2 Product Details

MC33FS6512LAER2 Overview


Tape & Reel (TR) is acceptable as a shipping the power management method.A convenient transport package is provided in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.This power management targets at System Basis Chip and other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.The power management operates at a voltage of 1V~5V volts.

MC33FS6512LAER2 Features


Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C

MC33FS6512LAER2 Applications


There are a lot of NXP USA Inc. MC33FS6512LAER2Power Management applications.

  • System Thermal for Servers
  • Tablets
  • HSTL Termination
  • Power Factor Correction
  • Isolated DC-DC Modules
  • Automotive Infotainment
  • FPGA
  • Peripheral I/O Power
  • Set-Top-Box
  • Applications Processors

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