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3169-0-00-15-00-00-03-0

3169-0-00-15-00-00-03-0

3169-0-00-15-00-00-03-0

Mill-Max Manufacturing Corp.

Contact PIN Solder ST Thru-Hole Bulk

SOT-23

3169-0-00-15-00-00-03-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass Alloy
Mount Through Hole
Mounting Type Through Hole
PackagingBulk
Series 3169
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
HTS Code8536.90.40.00
Contact Finish Gold
Terminal and Terminal Block Type PCB TERMINAL
Insulation Non-Insulated
Terminal TypePC Pin
Flange Diameter0.056 (1.42mm)
Terminal Style Double End
Pin Size - Above Flange 0.022 0.56mm Dia
Pin Size - Below Flange 0.018 0.46mm Dia
Contact Finish Thickness 10.0μin 0.25μm
Length - Overall 0.262 6.65mm
Length - Below Flange 0.132 3.35mm
Length - Above Flange 0.100 2.54mm
RoHS StatusROHS3 Compliant
In-Stock:9294 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.64000$0.64
10$0.60000$6
25$0.54000$13.5
50$0.48000$24
100$0.46000$46
250$0.42000$105
500$0.40000$200

About 3169-0-00-15-00-00-03-0

The 3169-0-00-15-00-00-03-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Contact PIN Solder ST Thru-Hole Bulk.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3169-0-00-15-00-00-03-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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