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8979-0-00-15-00-00-03-0

8979-0-00-15-00-00-03-0

8979-0-00-15-00-00-03-0

Mill-Max Manufacturing Corp.

CONN PC PIN CIRC 0.040DIA GOLD

SOT-23

8979-0-00-15-00-00-03-0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Contact MaterialBrass Alloy
Mount Press Fit
Mounting Type Through Hole
Mounting Hole Diameter 0.074 (1.88mm)
PackagingBulk
Published 2018
Series 8979
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Press-Fit, Hex
ECCN Code EAR99
HTS Code8536.90.40.00
Contact Finish Gold
Terminal and Terminal Block Type PCB TERMINAL
Insulation Non-Insulated
Terminal TypePC Pin
Hole Diameter 1.8796 mm
Flange Diameter0.078 (1.98mm)
Terminal Style Single End
Pin Size - Above Flange 0.040 1.02mm Dia
Length 9.6774mm
Contact Finish Thickness 10.0μin 0.25μm
Length - Overall 0.381 9.68mm
Length - Above Flange 0.321 8.15mm
RoHS StatusROHS3 Compliant
In-Stock:22420 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.350000$0.35
10$0.330189$3.30189
100$0.311499$31.1499
500$0.293867$146.9335
1000$0.277233$277.233

About 8979-0-00-15-00-00-03-0

The 8979-0-00-15-00-00-03-0 from Mill-Max Manufacturing Corp. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN PC PIN CIRC 0.040DIA GOLD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 8979-0-00-15-00-00-03-0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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