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M2S150-FCSG536I

M2S150-FCSG536I

M2S150-FCSG536I

Microsemi Corporation

536 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 293 I/O 1.2V

SOT-23

M2S150-FCSG536I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time 12 Weeks
Package / Case 536-LFBGA, CSPBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series SmartFusion®2
Published 2015
JESD-609 Code e0
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 536
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B536
Number of Outputs 293
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 293
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 293
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells146124
Flash Size 512KB
RoHS StatusRoHS Compliant
In-Stock:52 items

Pricing & Ordering

QuantityUnit PriceExt. Price
90$305.04878$27454.3902

M2S150-FCSG536I Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 536-LFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 150K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.293 I/Os are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 536 terminations, which makes system on a chip possible.A SoC chip with 293 outputs is available.A power supply of 1.2V is required.A SoC chip with 293 inputs is available.A logic SoC has 146124 logic cells.A 512KB flash can be seen on it.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.


There are a lot of Microsemi Corporation


M2S150-FCSG536I System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics

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