Welcome to Hotenda.com Online Store!

logo
userjoin
Home

M2S010-VFG256

M2S010-VFG256

M2S010-VFG256

Microsemi Corporation

256 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V Min 1.14V V Max 3.45V V

SOT-23

M2S010-VFG256 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status IN PRODUCTION (Last Updated: 2 days ago)
Factory Lead Time 11 Weeks
Package / Case 256-LBGA
Surface MountYES
Operating Temperature0°C~85°C TJ
PackagingTray
Series SmartFusion®2
Published 2015
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional FeatureLG-MIN, WD-MIN
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch0.8mm
Frequency 340MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of Outputs 138
Qualification StatusNot Qualified
Power Supplies1.2V
Max Supply Voltage3.45V
Min Supply Voltage1.14V
Memory Size256kB
Number of I/O 138
RAM Size 64KB
Memory TypeFLASH
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Propagation Delay3.316 ns
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 138
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 12084
Primary Attributes FPGA - 10K Logic Modules
Max Junction Temperature (Tj) 85°C
Flash Size 256KB
Height 1.56mm
Length 14mm
Width 14mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:224 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$39.74000$39.74
10$36.76000$367.6
119$31.39462$3735.95978

M2S010-VFG256 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 10K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 138 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 256 terminations.This SoC chip is capable of having 138 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 138 inputs.This flash has a size of 256KB.During operation, the wireless SoC runs at a frequency of 340MHz.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.Voltages up to 3.45V are specified for this SoC security.Power is provided to it at least to the extent that 1.14V is required.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN


There are a lot of Microsemi Corporation


M2S010-VFG256 System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control

Get Subscriber

Enter Your Email Address, Get the Latest News