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XC7Z045-1FFG676I

XC7Z045-1FFG676I

XC7Z045-1FFG676I

Xilinx Inc.

676 Terminations -40°C~100°C TJ XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V

SOT-23

XC7Z045-1FFG676I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact PlatingCopper, Silver, Tin
Package / Case 676-BBGA, FCBGA
Surface MountYES
Operating Temperature-40°C~100°C TJ
PackagingTray
Series Zynq®-7000
Published 2009
JESD-609 Code e1
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code8542.39.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z045
Pin Count676
JESD-30 Code S-PBGA-B676
Operating Supply Voltage1V
Supply Voltage-Max (Vsup) 1.05V
Power Supplies11.8V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Memory TypeROMless
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable N
Length 27mm
Height Seated (Max) 3.37mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:50 items

Pricing & Ordering

QuantityUnit PriceExt. Price

XC7Z045-1FFG676I Product Details

This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).


Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Kintex™-7 FPGA, 350K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.system on a chip benefits from 676 terminations.There is 11.8V power supply requirement for this system on chip SoC.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.During operation, the wireless SoC runs at a frequency of 667MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM


There are a lot of Xilinx Inc.


XC7Z045-1FFG676I System On Chip (SoC) applications.


  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
  • Remote control

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