This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 256-LFBGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion®2 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 10K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 138.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 256 terminations in total makes system on a chip possible.It is possible to use this SoC chip with 138 outputs.You will need to provide 1.2V power supplies in order to run system on chip.A SoC chip with 138 inputs is available to the user.12084 logic cells are included in logic system on chips.There is a flash of 256KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010-1VF256 System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
