Welcome to Hotenda.com Online Store!

logo
userjoin
Home

A2F200M3F-FG484

A2F200M3F-FG484

A2F200M3F-FG484

Microsemi Corporation

484 Terminations 0°C~85°C TJ 484 Pin A2F200 System On Chip SmartFusion® Series MCU - 41, FPGA - 94 I/O 1.5V

SOT-23

A2F200M3F-FG484 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Package / Case 484-BGA
Surface MountYES
Number of Pins 484
Operating Temperature0°C~85°C TJ
PackagingTray
Series SmartFusion®
JESD-609 Code e0
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch1mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A2F200
Number of Outputs 94
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Operating Supply Current 2mA
Number of I/O MCU - 41, FPGA - 94
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates200000
Number of Logic Blocks (LABs) 8
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Length 23mm
Height Seated (Max) 2.44mm
Width 23mm
RoHS StatusNon-RoHS Compliant
In-Stock:176 items

Pricing & Ordering

QuantityUnit PriceExt. Price
60$41.20000$2472

A2F200M3F-FG484 Product Details

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.It is important to note that this SoC security combines ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 41, FPGA - 94 I/Os are included in this SoC part.A 1.5V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.575V.At least 1.425V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 484 terminations, which makes system on a chip possible.A SoC chip with 94 outputs is available.A 256KB flash can be seen on it.Search A2F200 for system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.Core architecture of ARM underpins the SoC meaning.There is a 484-pin version of this computer SoC available.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


A2F200M3F-FG484 System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics

Get Subscriber

Enter Your Email Address, Get the Latest News