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APTGL90H120T3G

APTGL90H120T3G

APTGL90H120T3G

Microsemi Corporation

Trans IGBT Module N-CH 1.2KV 110A 20-Pin Case SP-3

SOT-23

APTGL90H120T3G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 36 Weeks
Mount Chassis Mount, Screw
Mounting Type Chassis Mount
Package / Case SP3
Number of Pins 20
Operating Temperature-40°C~175°C TJ
Published 2012
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Subcategory Insulated Gate BIP Transistors
Max Power Dissipation385W
Number of Elements 1
Configuration Full Bridge
Power - Max 385W
Input Standard
Collector Emitter Voltage (VCEO) 1.2kV
Max Collector Current 110A
Current - Collector Cutoff (Max) 250μA
Collector Emitter Breakdown Voltage1.2kV
Voltage - Collector Emitter Breakdown (Max) 1200V
Input Capacitance4.4nF
Vce(on) (Max) @ Vge, Ic 2.25V @ 15V, 75A
IGBT Type Trench Field Stop
NTC ThermistorYes
Input Capacitance (Cies) @ Vce 4.4nF @ 25V
VCEsat-Max 2.25 V
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:107 items

Pricing & Ordering

QuantityUnit PriceExt. Price
100$71.22260$7122.26

About APTGL90H120T3G

The APTGL90H120T3G from Microsemi Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features Trans IGBT Module N-CH 1.2KV 110A 20-Pin Case SP-3.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the APTGL90H120T3G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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