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VSC8257YMR-01

VSC8257YMR-01

VSC8257YMR-01

Microchip Technology

Telecom device4 Circuits

SOT-23

VSC8257YMR-01 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 256-BBGA, FCBGA
Supplier Device Package 256-FCBGA (17x17)
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1V 1.2V
Function Ethernet
Interface SPI
Number of Circuits 4
RoHS StatusROHS3 Compliant
In-Stock:84 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$86.13000$86.13
25$71.75000$1793.75
100$69.33190$6933.19

VSC8257YMR-01 Product Details

VSC8257YMR-01 Overview


Space is saved on the board by using the 256-BBGA, FCBGA package.In order to pack telecommunications equipment, Tray is used.Telecommunications equipment is mounted using Surface Mount.A 4 circuit is the heart of this telecom IC .When 1V 1.2V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.

VSC8257YMR-01 Features


Available in the 256-BBGA, FCBGA package

VSC8257YMR-01 Applications


There are a lot of Microchip Technology VSC8257YMR-01 Telecom applications.

  • LAN Routers
  • Cable Modem
  • SDH/SONET multiplexers
  • Digital subscriber line access multiplexer (DSLAM)
  • PBX interfaces
  • E1 Multiplexer
  • Digital access cross connects
  • E3/DS3 Access Equipment
  • T1/E1/J1 Multiplexer and Channel Banks
  • Channel Service Units (CSUs): T1/E1/J1

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