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VSC8562XKS-11

VSC8562XKS-11

VSC8562XKS-11

Microchip Technology

Telecom device

SOT-23

VSC8562XKS-11 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-PBGA (17x17)
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS StatusROHS3 Compliant
In-Stock:268 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$25.59000$25.59
25$21.32120$533.03
100$20.60000$2060

VSC8562XKS-11 Product Details

VSC8562XKS-11 Overview


Space is saved on the board by using the 256-BGA package.A Tray-packing method is used to pack telecommunications equipment.The mounting type of this telecom circuit is Surface Mount.

VSC8562XKS-11 Features


Available in the 256-BGA package

VSC8562XKS-11 Applications


There are a lot of Microchip Technology VSC8562XKS-11 Telecom applications.

  • M13 MUX
  • Router
  • Channel Service Units (CSUs): T1/E1/J1
  • E1 LAN/WAN Routers
  • Integrated Access Devices (IADs)
  • E1 Network Equipment
  • Interfaces to DS3
  • PCM Test Equipment
  • T1/E1/J1 Performance Monitoring
  • Integrated Multi-Service Access Platforms (IMAPs)

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