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TGF30-07870787-059

TGF30-07870787-059

TGF30-07870787-059

Leader Tech Inc.

THERM PAD 199.9MMX199.9MM BLUE

SOT-23

TGF30-07870787-059 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Material Aluminum Oxide filled Silicone
Shape Square
Published 2015
Series TGF30
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Color Blue
Shelf Life 24 Months
Adhesive Tacky - Both Sides
Outline 199.90mm x 199.90mm
Thermal Conductivity3.0W/m-K
Thermal Resistivity0.90°C/W
Thickness 0.0591 1.500mm
RoHS StatusROHS3 Compliant
In-Stock:256 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$28.785593$28.785593
10$27.156220$271.5622
100$25.619075$2561.9075
500$24.168939$12084.4695
1000$22.800886$22800.886

About TGF30-07870787-059

The TGF30-07870787-059 from Leader Tech Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features THERM PAD 199.9MMX199.9MM BLUE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TGF30-07870787-059, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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