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A15330-03

A15330-03

A15330-03

Laird Technologies - Thermal Materials

Thermal Interface Products Tflex 3100 DC1 9x9" 1.2W/mK

SOT-23

A15330-03 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone Elastomer
Shape Square
PackagingBulk
Published 2010
Series Tflex™ 300
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Gap Filler Pad, Sheet
Max Operating Temperature160°C
Min Operating Temperature -40°C
Color Green
Breakdown Voltage10kV
Outline 228.60mm x 228.60mm
Thermal Conductivity1.2W/m-K
Natural Thermal Resistance 2.11 °C/W
Thermal Resistivity2.11°C/W
Length 229mm
Width 229mm
Thickness 0.100 2.54mm
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:463 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$16.482950$16.48295
10$15.549953$155.49953
100$14.669768$1466.9768
500$13.839403$6919.7015
1000$13.056040$13056.04

About A15330-03

The A15330-03 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features Thermal Interface Products Tflex 3100 DC1 9x9" 1.2W/mK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A15330-03, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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