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HI06UT03P600R10

HI06UT03P600R10

HI06UT03P600R10

LAIRDSIGNALINTEGRITYPRODUCTS

HI06UT03P600R10 datasheet pdf and Backplanes product details from LAIRDSIGNALINTEGRITYPRODUCTS stock available on our website

SOT-23

HI06UT03P600R10 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 1 day ago)
Lifecycle Status 10 Weeks
Mount Chassis
Mounting Type Press Fit, Through Hole
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 6
Operating Temperature 0°C ~ 70°C
Packaging Box
Pbfree Code -
Part Status -
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 6
ECCN Code -
Temperature Coefficient -
Subcategory Operational Amplifier
Voltage - Supply 4V ~ 30V
Base Part Number Fjd Jelm
Output Voltage 64 V
Output Type Analog Voltage
Interface Analog
Termination Type SOLDER
Operating Supply Current -
Nominal Supply Current 700 μA
Output Current 30 mA
Max Supply Current 700 μA
Slew Rate -
Architecture -
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:4937 items

About HI06UT03P600R10

The HI06UT03P600R10 from LAIRDSIGNALINTEGRITYPRODUCTS is a high-performance microcontroller designed for a wide range of embedded applications. This component features HI06UT03P600R10 datasheet pdf and Backplanes product details from LAIRDSIGNALINTEGRITYPRODUCTS stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HI06UT03P600R10, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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