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A15754-13

A15754-13

A15754-13

Laird Technologies - Thermal Materials

TFLEX SF8130

SOT-23

A15754-13 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Non-Silicone
Shape Square
Series Tflex™ SF800
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Adhesive Tacky - Both Sides
Outline 228.60mm x 228.60mm
Thermal Conductivity7.8W/m-K
Thermal Resistivity0.19°C/W
Thickness 0.130 3.30mm
RoHS StatusRoHS Compliant
In-Stock:59 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$337.430348$337.430348
10$318.330517$3183.30517
100$300.311809$30031.1809
500$283.313027$141656.5135
1000$267.276440$267276.44

About A15754-13

The A15754-13 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features TFLEX SF8130.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A15754-13, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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