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A17883-07

A17883-07

A17883-07

Laird Technologies - Thermal Materials

A17883-07 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A17883-07 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ HD80000
Part StatusActive
Moisture Sensitivity Level (MSL) Vendor Undefined
Type Gap Filler Pad, Sheet
Color Teal
Shelf Life 24 Months
Storage/Refrigeration Temperature 32°F~95°F 0°C~35°C
Shelf Life Start Date of Manufacture
Backing, Carrier Liner
Outline 228.60mm x 228.60mm
Thermal Conductivity6.0W/m-K
Thickness 0.0700 1.778mm
RoHS StatusRoHS Compliant
In-Stock:95 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$133.97000$133.97
500$132.6303$66315.15
1000$131.2906$131290.6
1500$129.9509$194926.35
2000$128.6112$257222.4
2500$127.2715$318178.75

About A17883-07

The A17883-07 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A17883-07 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A17883-07, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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