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A10463-02

A10463-02

A10463-02

Laird Technologies - Thermal Materials

A10463-02 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website

SOT-23

A10463-02 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Material Graphite
Shape Rectangular
PackagingBulk
Series Tgon™ 810
Published 2009
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Graphite-Pad, Sheet
Max Operating Temperature300°C
Min Operating Temperature -240°C
Color Gray
Adhesive Adhesive - One Side
Outline 457.20mm x 304.80mm
Thermal Conductivity5.0W/m-K
Natural Thermal Resistance 0.1 °C/W
Thermal Resistivity0.10°C/W
Length 305mm
Width 457mm
Thickness 0.0100 0.254mm
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:435 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$14.92000$14.92
10$14.09300$140.93
25$13.26400$331.6
50$12.43500$621.75
100$11.60600$1160.6
250$10.77700$2694.25
500$10.56976$5284.88

About A10463-02

The A10463-02 from Laird Technologies - Thermal Materials is a high-performance microcontroller designed for a wide range of embedded applications. This component features A10463-02 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the A10463-02, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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