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GPTGP7000ULM-0.125-02-0808

GPTGP7000ULM-0.125-02-0808

GPTGP7000ULM-0.125-02-0808

Bergquist

GAP PAD 8X8" SHEET 0.125"

SOT-23

GPTGP7000ULM-0.125-02-0808 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Material Silicone
Shape Square
Series Gap Pad® 7000ULM
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Shelf Life 6 Months
Adhesive Tacky - Both Sides
Storage/Refrigeration Temperature 77°F 25°C
Shelf Life Start Date of Manufacture
Outline 203.20mm x 203.20mm
Thermal Conductivity7.0W/m-K
Thickness 0.125 3.18mm
RoHS StatusROHS3 Compliant
In-Stock:56 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$310.65000$310.65
500$307.5435$153771.75
1000$304.437$304437
1500$301.3305$451995.75
2000$298.224$596448
2500$295.1175$737793.75

About GPTGP7000ULM-0.125-02-0808

The GPTGP7000ULM-0.125-02-0808 from Bergquist is a high-performance microcontroller designed for a wide range of embedded applications. This component features GAP PAD 8X8" SHEET 0.125".

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the GPTGP7000ULM-0.125-02-0808, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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