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LDBAA2220GC5N0

  • LDBAA2220GC5N0 - LDB 0.022μF Film Capacitor ±2% 1206 (3216 Metric) Solder Pads 16V-DC Polyphenylene Sulfide (PPS), Metallized - Stacked PCB, Surface Mount
  • LDBAA2220GC5N0 - LDB 0.022μF Film Capacitor ±2% 1206 (3216 Metric) Solder Pads 16V-DC Polyphenylene Sulfide (PPS), Metallized - Stacked PCB, Surface Mount

LDBAA2220GC5N0

LDBAA2220GC5N0

KEMET

LDB 0.022μF Film Capacitor ±2% 1206 (3216 Metric) Solder Pads 16V-DC Polyphenylene Sulfide (PPS), Metallized - Stacked PCB, Surface Mount

SOT-23

LDBAA2220GC5N0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 23 Weeks
Mount PCB, Surface Mount
Mounting Type Surface Mount
Package / Case 1206 (3216 Metric)
Terminal Shape WRAPAROUND
Dielectric MaterialPolyphenylene Sulfide (PPS), Metallized - Stacked
Operating Temperature-55°C~125°C
PackagingCut Tape (CT)
Published 2007
Series LDB
Size / Dimension 0.130Lx0.067W 3.30mmx1.70mm
Tolerance ±2%
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 2
Termination Solder Pads
ECCN Code EAR99
Applications General Purpose
Voltage - Rated 16V
Capacitance 0.022μF
Voltage - Rated DC 16V
Packing Method TR
Depth 1.7mm
Reference Standard AEC-Q200
Case Code (Metric) 3216
Case Code (Imperial) 1206
Capacitor Type FILM CAPACITOR
Dielectric PPS
Voltage 16V
Dissipation Factor0.6 %
Height 1.1mm
Height Seated (Max) 0.043 1.10mm
Length 3.3mm
RoHS StatusROHS3 Compliant
In-Stock:8537 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.828355$0.828355
10$0.781467$7.81467
100$0.737233$73.7233
500$0.695503$347.7515
1000$0.656135$656.135

LDBAA2220GC5N0 Product Details

LDBAA2220GC5N0 Overview


In addition to operating at -55°C~125°C degrees, the device is capable of operating at other temperatures as well.

LDBAA2220GC5N0 Features



LDBAA2220GC5N0 Applications


There are a lot of KEMET LDBAA2220GC5N0 applications of film capacitors.

  • Coupling, decoupling
  • Switch mode power supplies
  • IGBT
  • TV and monitor sets
  • Audio/video equipment
  • Mobile communications
  • RFI for automotive
  • Bypassing
  • RF Modules
  • Matching networks

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