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IDT71T75602S200BGGI8

IDT71T75602S200BGGI8

IDT71T75602S200BGGI8

Integrated Device Technology (IDT)

2.5V V 119 Pin Memory IC 22mm mm

SOT-23

IDT71T75602S200BGGI8 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case BGA
Surface MountYES
PackagingTape & Reel (TR)
Published 2010
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 119
ECCN Code 3A991.B.2.A
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Additional FeaturePIPELINED ARCHITECTURE
HTS Code8542.32.00.41
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch1.27mm
Reach Compliance Code unknown
Frequency 200MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count119
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 2.625V
Power Supplies2.5V
Temperature GradeINDUSTRIAL
Supply Voltage-Min (Vsup) 2.375V
Interface Parallel
Memory TypeRAM, SRAM
Operating ModeSYNCHRONOUS
Organization 512KX36
Output Characteristics 3-STATE
Memory Width 36
Memory Density 18874368 bit
Access Time (Max) 3.2 ns
I/O Type COMMON
Standby Voltage-Min 2.38V
Length 22mm
Height Seated (Max) 2.36mm
Width 14mm
RoHS StatusRoHS Compliant
In-Stock:1326 items

IDT71T75602S200BGGI8 Product Details

IDT71T75602S200BGGI8 Overview


RAM, SRAM is the type of memory it has. There is a Tape & Reel (TR) case available. The BGA case contains it. The chip has 119 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 2.5V of power. There are 119 pins on this memory device, which indicates it has 119 memory locations in it. Despite all its merits, this chip also features PIPELINED ARCHITECTURE to boost system performance. When it comes to power supplies, this memory chip only requires 2.5V . I/O port addresses on this device are mapped to memory addresses of COMMON bits. This device must operate at a minimum temperature of -40°C. Temperatures no higher than 85°C degrees Celsius are recommended for operation. Data is processed by this memory ics at a frequency of 200MHz.

IDT71T75602S200BGGI8 Features


Package / Case: BGA
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 200MHz
200MHz terminals


IDT71T75602S200BGGI8 Applications


There are a lot of Integrated Device Technology (IDT)
IDT71T75602S200BGGI8 Memory applications.


  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,

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