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TLE7237GS

TLE7237GS

TLE7237GS

Infineon Technologies

Hot Swap Controllers SSOP

SOT-23

TLE7237GS Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case SSOP
Number of Pins 24
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 24
ECCN Code EAR99
Resistance 1.6Ohm
Max Operating Temperature150°C
Min Operating Temperature -40°C
Subcategory Peripheral Drivers
Technology CMOS
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch0.635mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count24
Number of Outputs 8
Qualification StatusNot Qualified
Max Output Current1A
Power Supplies3.3/5V
Max Supply Current 15mA
Current - Output 130mA
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Driver Number of Bits 8
Screening Level AEC-Q100
Output Peak Current Limit-Nom 0.38A
Output Current Flow Direction SINK
RoHS StatusRoHS Compliant
In-Stock:1728 items

TLE7237GS Product Details

TLE7237GS Overview


The SSOP package contains it.There are 24 terminations in total.This device has a terminal position of DUAL.24 pins make up its total.24 pins are used to operate the system.The gadget in Peripheral Drivers is self-contained.Surface Mount is its direction of movement.Hot-swappable device is stable to operate at a temperature of 150°C°C at the maximum.Hot-swappable device works at a minimum temperature of -40°C degrees Celsius to maintain reliabilHot-swappable devicey.Hot-swappable device has a 3.3/5V power supply, which is the power supply used in the part.The default setting is output 8.Maximum output current drops to 1A to meet operation criteria.15mA is the maximum current required for its operation.There is 1.6Ohm resistance in the device.

TLE7237GS Features


The terminal position of 24


TLE7237GS Applications


There are a lot of Infineon Technologies
TLE7237GS hot swap controllers applications.


  • Telecommunications
  • Industrial
  • Datacom
  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes

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