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BTS50070-1TMB

BTS50070-1TMB

BTS50070-1TMB

Infineon Technologies

1 Hot Swap Controllers TO-220-7 1

SOT-23

BTS50070-1TMB Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case TO-220-7
Surface MountYES
Number of Pins 7
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 7
ECCN Code EAR99
Resistance 7mOhm
Terminal Finish Tin (Sn)
Max Operating Temperature150°C
Min Operating Temperature -40°C
Subcategory Peripheral Drivers
Terminal Position SINGLE
Terminal FormGULL WING
Supply Voltage 12V
Pin Count3
Max Output Current90A
Number of Channels 1
Max Supply Voltage30V
Min Supply Voltage5.5V
Nominal Supply Current1.4mA
Halogen Free Halogen Free
Output Current per Channel 12A
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Driver Number of Bits 1
Output Peak Current Limit-Nom 12A
Output Current Flow Direction SINK
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:1071 items

BTS50070-1TMB Product Details

BTS50070-1TMB Overview


You get it with the TO-220-7 package.Currently, 1 channels can be accessed.Hot-swappable device terminates wHot-swappable deviceh 7 in total.Device SINGLE is in the terminal position.Total number of pins is 3.High efficiency can be achieved with a voltage supply of 12V.Operating the device requires 7 pins.Peripheral Drivers contains this gadget on its own.Stable operation can be achieved with a maximum operating temperature of 150°C°C.Hot-swappable device operates at a minimum temperature of -40°C degrees Celsius in order to ensure reliabilHot-swappable devicey.There is a maximum supply voltage of 30VV that it can handle.Low supply voltages, such as 5.5VV, are possible.When operating criteria are met, the maximum output current is reduced to 90A.Resistance to 7mOhm is present in the device.

BTS50070-1TMB Features


The terminal position of 3


BTS50070-1TMB Applications


There are a lot of Infineon Technologies
BTS50070-1TMB hot swap controllers applications.


  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads
  • Distributed power systems

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