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IRF9952TRPBF

IRF9952TRPBF

IRF9952TRPBF

Infineon Technologies

IRF9952TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website

SOT-23

IRF9952TRPBF Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2004
Series HEXFET®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Resistance 100mOhm
Additional FeatureHIGH RELIABILITY
Max Power Dissipation2W
Terminal Position DUAL
Terminal FormGULL WING
Current Rating3.5A
Base Part Number IRF9952PBF
Number of Elements 2
Operating ModeENHANCEMENT MODE
Power Dissipation2W
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 100m Ω @ 2.2A, 10V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 190pF @ 15V
Current - Continuous Drain (Id) @ 25°C 3.5A 2.3A
Gate Charge (Qg) (Max) @ Vgs 14nC @ 10V
Rise Time14ns
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Turn-Off Delay Time 20 ns
Continuous Drain Current (ID) 3.5A
Threshold Voltage 1V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 30V
Pulsed Drain Current-Max (IDM) 16A
Avalanche Energy Rating (Eas) 44 mJ
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs 1 V
Height 1.4986mm
Length 4.9784mm
Width 3.9878mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Contains Lead, Lead Free
In-Stock:6587 items

Pricing & Ordering

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IRF9952TRPBF Product Details

IRF9952TRPBF Description


In the new generation of hexadecimal transistors, rectifiers use advanced processing technology to achieve extremely low on-resistance per silicon area. Combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, it provides designers with an extremely efficient and reliable device for use in a variety of applications.The SO-8 has been modified through custom lead frames to enhance thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of powerapplications.Withtheseimprovementsmultiple devices that can be used to greatly reduce circuit board space. Infrared welding technology.


IRF9952TRPBF Features


Generation VTechnology Ultra Low On-Resistance

Dual N and P Channe MOSFET Surface Mount

Very Low Gate Charge and Switching Losses

Fully Avalanche Rated Lead-Free

IRF9952TRPBF Applications


it provides designers with an extremely efficient and reliable device for use in a variety of applications.

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