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FDC6327C

FDC6327C

FDC6327C

ON Semiconductor

FDC6327C datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website

SOT-23

FDC6327C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SOT-23-6 Thin, TSOT-23-6
Number of Pins 6
Weight 36mg
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2000
Series PowerTrench®
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
Termination SMD/SMT
ECCN Code EAR99
Resistance 80MOhm
Terminal Finish TIN (SN)
Subcategory Other Transistors
Max Power Dissipation960mW
Terminal FormGULL WING
Current Rating2.7A
Number of Elements 2
Number of Channels 2
Element ConfigurationDual
Operating ModeENHANCEMENT MODE
Power Dissipation960mW
Power - Max 700mW
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 80m Ω @ 2.7A, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 325pF @ 10V
Current - Continuous Drain (Id) @ 25°C 2.7A 1.9A
Gate Charge (Qg) (Max) @ Vgs 4.5nC @ 4.5V
Rise Time14ns
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Turn-Off Delay Time 14 ns
Continuous Drain Current (ID) 1.9A
Threshold Voltage 900mV
Gate to Source Voltage (Vgs) 8V
Drain to Source Breakdown Voltage 20V
FET Technology METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj) 150°C
FET Feature Logic Level Gate
Nominal Vgs 900 mV
Height 1.1mm
Length 3mm
Width 1.7mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:14769 items

Pricing & Ordering

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FDC6327C Product Details

FDC6327C Description


These Nipp channel 2.5V MOSFET are manufactured using an advanced PowerTritch process tailored to minimize on-resistance while maintaining low gate charge for excellent switching performance. These devices are designed to provide excellent power consumption in a very small footprint and are suitable for impractical applications in larger and more expensive SO-8 and TSSOP-8 packages.

FDC6327C Features

N-Channel

?2.7A, 20V

?RDS(on) = 0.08|? @ VGS = 4.5V

?RDS(on) = 0.12|? @ VGS = 2.5V

P-Channel

?-1.6A, -20V

?RDS(on) = 0.17|? @ VGS = -4.5V

?RDS(on) = 0.25|? @ VGS = -2.5V

Fast switching speed.

Low gate charge.

High performance trench technology for extremelylow RDS(ON) .

SuperSOT? -6 package: small footprint (72% smallerthan standard SO-8); low profile (1mm thick).


FDC6327C Applications

This product is general usage and suitable for many different applications.




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