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IRF7700

IRF7700

IRF7700

Infineon Technologies

IRF7700 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

SOT-23

IRF7700 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173, 4.40mm Width)
Surface MountYES
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTube
Published 2007
Series HEXFET®
JESD-609 Code e3
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional FeatureHIGH RELIABILITY
Subcategory Other Transistors
Technology MOSFET (Metal Oxide)
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 30
JESD-30 Code R-PDSO-G8
Qualification StatusNot Qualified
Number of Elements 1
Configuration SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max 1.5W Tc
Operating ModeENHANCEMENT MODE
FET Type P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 15m Ω @ 8.6A, 4.5V
Vgs(th) (Max) @ Id 1.2V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 4300pF @ 15V
Current - Continuous Drain (Id) @ 25°C 8.6A Tc
Gate Charge (Qg) (Max) @ Vgs 89nC @ 5V
Drain to Source Voltage (Vdss) 20V
Drive Voltage (Max Rds On,Min Rds On) 2.5V 4.5V
Vgs (Max) ±12V
JEDEC-95 Code MO-153AA
Drain Current-Max (Abs) (ID) 8.6A
Drain-source On Resistance-Max 0.015Ohm
Pulsed Drain Current-Max (IDM) 68A
DS Breakdown Voltage-Min 20V
RoHS StatusNon-RoHS Compliant
In-Stock:2557 items

IRF7700 Product Details

IRF7700 Description


International Rectifier's HEXFET? power MOSFETs use cutting-edge processing methods to produce extraordinarily low on-resistance per silicon area. This benefit, along with the ruggedized device design for which International Rectifier is renowned, gives the designer access to a very effective and dependable tool for load and battery management.

The footprint area of the TSSOP-8 package is 45% smaller than that of the conventional SO-8. In situations where printed circuit board space is at a premium, the TSSOP-8 is the perfect device. The TSSOP-8 will be able to readily fit into extremely thin application contexts like portable electronics and PCMCIA cards thanks to its low profile (1.1mm).



IRF7700 Features


  • Ultra Low On-Resistance

  • P-Channel MOSFET

  • Very Small SOIC Package

  • Low Profile (< 1.1mm)

  • Available in Tape & Reel



IRF7700 Applications


  • Power Management

  • Consumer Electronics

  • Portable Devices

  • Industrial


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