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IRF7389TRPBF

IRF7389TRPBF

IRF7389TRPBF

Infineon Technologies

IRF7389TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website

SOT-23

IRF7389TRPBF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Contact PlatingTin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2004
Series HEXFET®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Resistance 29mOhm
Additional FeatureAVALANCHE RATED, ULTRA LOW RESISTANCE
Max Power Dissipation2.5W
Terminal Position DUAL
Terminal FormGULL WING
Current Rating7.3A
Base Part Number IRF7389PBF
Number of Elements 2
Row Spacing6.3 mm
Number of Channels 1
Operating ModeENHANCEMENT MODE
Power Dissipation2.5W
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 29m Ω @ 5.8A, 10V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 650pF @ 25V
Gate Charge (Qg) (Max) @ Vgs 33nC @ 10V
Rise Time13ns
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Fall Time (Typ) 32 ns
Turn-Off Delay Time 34 ns
Continuous Drain Current (ID) 7.3A
Threshold Voltage 1V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 30V
Pulsed Drain Current-Max (IDM) 30A
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs 1 V
Height 1.4986mm
Length 4.9784mm
Width 3.9878mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Contains Lead, Lead Free
In-Stock:4972 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.23000$1.23
500$1.2177$608.85
1000$1.2054$1205.4
1500$1.1931$1789.65
2000$1.1808$2361.6
2500$1.1685$2921.25

IRF7389TRPBF Product Details

IRF7389TRPBF Description


In order to produce extraordinarily low on-resistance per silicon area, International Rectifier's Fifth Generation HEXFETs employ cutting-edge processing processes. With this benefit combined with the high switching speed and ruggedized device architecture that HEXFET Power MOSFETs are renowned for, the designe is given an incredibly efficient and dependable device for usage in a number of applications. Its improved thermal properties and multiple-die capacity make the SO-8 perfect for a variety of power applications. This modification was made possible by a specially designed leadframe. This advancement allows for the usage of many devices while drastically reducing the amount of board space needed. Vapor phase infrared, or wave soldering technology is intended for use with the packaging.



IRF7389TRPBF Features


  • Generating Technology V

  • Extremely Low On-Resistant

  • Offering a Free Half Bridge

  • The Surface Mount

  • Complete Avalanche Rating

  • Lead-Free



IRF7389TRPBF Applications


Switching applications


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