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IRF7319TRPBF

IRF7319TRPBF

IRF7319TRPBF

Infineon Technologies

IRF7319TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website

SOT-23

IRF7319TRPBF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Contact PlatingTin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 1997
Series HEXFET®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Resistance 29mOhm
Additional FeatureAVALANCHE RATED, ULTRA LOW RESISTANCE
Max Power Dissipation2W
Terminal Position DUAL
Terminal FormGULL WING
Current Rating6.5A
Base Part Number IRF7319PBF
Number of Elements 2
Row Spacing6.3 mm
Operating ModeENHANCEMENT MODE
Power Dissipation2W
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 29m Ω @ 5.8A, 10V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 650pF @ 25V
Gate Charge (Qg) (Max) @ Vgs 33nC @ 10V
Rise Time13ns
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Fall Time (Typ) 32 ns
Turn-Off Delay Time 34 ns
Continuous Drain Current (ID) 6.5A
Threshold Voltage 1V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 30V
Pulsed Drain Current-Max (IDM) 30A
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Standard
Nominal Vgs 1 V
Height 1.4986mm
Length 4.9784mm
Width 3.9878mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Contains Lead, Lead Free
In-Stock:6171 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.37000$1.37
500$1.3563$678.15
1000$1.3426$1342.6
1500$1.3289$1993.35
2000$1.3152$2630.4
2500$1.3015$3253.75

IRF7319TRPBF Product Details

IRF7319TRPBF Description


The fifth generation HEXFET of International Rectifier Company adopts advanced technology to achieve extremely low on-resistance per silicon area. Combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, it provides designers with an extremely efficient and reliable device that can be used in a variety of applications.

SO-8 is improved through customized ead rame to enhance thermomechanical properties and multi-chip capabilities, making it suitable for power applications. Through these improvements, a variety of devices can be used in applications that significantly reduce circuit board space. The package is designed for gas phase, infrared or wave soldering technology.



IRF7319TRPBF Features


Generation VTechnology

Ultra Low On-Resistance

Dual N and P Channel MOSFET

Surface Mount

Fully Avalanche Rated

Lead-Free


IRF7319TRPBF Applications


it provides designers with an extremely efficient and reliable device that can be used in a variety of applications.






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