Name: IRF7304
Brand: Infineon Technologies
SKU: IRF7304
Price: 1.09000 USD
Availability: InStock

Technical Specifications

Parameter Name	Value
Type	Parameter
Mounting Type	Surface Mount
Package / Case	8-SOIC (0.154, 3.90mm Width)
Surface Mount	YES
Transistor Element Material	SILICON
Operating Temperature	-55°C~150°C TJ
Packaging	Tube
Published	1997
Series	HEXFET®
JESD-609 Code	e0
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	8
ECCN Code	EAR99
Terminal Finish	Tin/Lead (Sn/Pb)
Additional Feature	LOGIC LEVEL COMPATIBLE
HTS Code	8541.29.00.95
Terminal Form	GULL WING
Peak Reflow Temperature (Cel)	245
[email protected] Reflow Temperature-Max (s)	30
JESD-30 Code	R-PDSO-G8
Qualification Status	Not Qualified
Number of Elements	2
Configuration	SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
Operating Mode	ENHANCEMENT MODE
Power - Max	2W
FET Type	2 P-Channel (Dual)
Rds On (Max) @ Id, Vgs	90m Ω @ 2.2A, 4.5V
Vgs(th) (Max) @ Id	700mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds	610pF @ 15V
Current - Continuous Drain (Id) @ 25°C	4.3A
Gate Charge (Qg) (Max) @ Vgs	22nC @ 4.5V
Drain to Source Voltage (Vdss)	20V
Drain Current-Max (Abs) (ID)	3.6A
Drain-source On Resistance-Max	0.09Ohm
DS Breakdown Voltage-Min	20V
FET Technology	METAL-OXIDE SEMICONDUCTOR
FET Feature	Logic Level Gate
RoHS Status	Non-RoHS Compliant

IRF7304 Product Details

IRF7304 Description

The fifth generation HEXFET of International Rectifier Company uses advanced technology to achieve minimum on-resistance, combines the well-known fast switching speed and rugged device design of HEXFET power MOSFET, and provides designers with an extremely efficient device used in a variety of applications.

The SO-8 has been improved by customizing lead frames to enhance thermal properties and a variety of capabilities to handle a variety of power applications. With these improvements, multiple devices can be used in one application while reducing circuit board space. The package is designed for vapor phase infrared. Or wave soldering technology in typical printed circuit board placement applications, power consumption of more than 0.8W is possible.