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IRF7105TRPBF

IRF7105TRPBF

IRF7105TRPBF

Infineon Technologies

IRF7105TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website

SOT-23

IRF7105TRPBF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2003
Series HEXFET®
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Resistance 100mOhm
Terminal Finish Matte Tin (Sn)
Additional FeatureULTRA LOW RESISTANCE
Max Power Dissipation2W
Terminal Position DUAL
Terminal FormGULL WING
Current Rating3.5A
Base Part Number IRF7105PBF
Number of Elements 2
Number of Channels 2
Operating ModeENHANCEMENT MODE
Power Dissipation2W
Turn On Delay Time7 ns
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 100m Ω @ 1A, 10V
Vgs(th) (Max) @ Id 3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 330pF @ 15V
Current - Continuous Drain (Id) @ 25°C 3.5A 2.3A
Gate Charge (Qg) (Max) @ Vgs 27nC @ 10V
Rise Time13ns
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Fall Time (Typ) 37 ns
Turn-Off Delay Time 45 ns
Continuous Drain Current (ID) 3.5A
Threshold Voltage 1V
Gate to Source Voltage (Vgs) 20V
Drain to Source Breakdown Voltage 25V
Pulsed Drain Current-Max (IDM) 14A
FET Technology METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj) 150°C
FET Feature Standard
Nominal Vgs 3 V
Height 1.75mm
Length 4.9784mm
Width 3.9878mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:9712 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.332856$0.332856
10$0.314015$3.14015
100$0.296240$29.624
500$0.279472$139.736
1000$0.263653$263.653

IRF7105TRPBF Product Details

IRF7105TRPBF Description

The fifth generation HEXFET from the international rectifier uses advanced processing technology to achieve the lowest possible on-resistance per silicon area. Combined with fast switching speed and rugged device characteristics, HEXFETPower MOSFET is well known, providing designers with an extremely efficient device for use in a variety of applications.SO-8 is improved by customizing lead frames to enhance thermal and multi-chip capabilities, making it an ideal choice for a variety of power applications. Through these improvements, multiple devices can be used in applications that significantly reduce circuit board space. The package is designed for vapor phase infrared or wave soldering technology. In typical PCB placement applications, it is possible to consume more than 0.8W.


IRF7105TRPBF Features


Advanced Process Technology

Ultra Low On-Resistance

Dual N and P Channel Mosfet

Surface Mount

Available in Tape &Reel

Dynamic dv/dt Rating

Fast Switching

Lead-Free

IRF7105TRPBF Applications


providing designers with an extremely efficient device for use in a variety of applications.




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