Description
The IRF6100 is a HEXFET? Power MOSFET. International Rectifier offers genuine chip-scale packaging. Extremely low on-resistance and the highest power densities in the industry have been made accessible for battery and load management applications through the use of cutting-edge processing techniques and a novel packaging architecture. These advantages, along with the ruggedized device design for which International Rectifier is renowned, give the designer access to a very effective and dependable tool.
The FlipFET? package has a profile of less than.8mm and has a footprint that is one-third that of a comparable SOT-23 package. This makes the FlipFET? the ideal device for applications where printed circuit board space is at a premium and in extremely thin application contexts, such as battery packs, cell phones, and PCMCIA cards. This is combined with the low thermal resistance of the die-level device.
Features
One-third Footprint of SOT-23
Super Low Profile (<.8mm)
Available Tested on Tape & Reel
Ultra Low RDS(on) per Footprint Area
Low Thermal Resistance
P-Channel MOSFET
Applications
