IRF5305STRRPBF Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide ultra-low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications. The D2Pak is a surface mount power package that can fit die up to HEX-4 in size. It has the highest power capabilities and the lowest on-resistance of any surface mount package currently available. Because of its low internal connection resistance, the D2Pak is appropriate for high current applications and can dissipate up to 2.01N in a typical surface mount application. For low-profile applications, the through-hole variant (IRF5305L) is offered.
IRF5305STRRPBF Features
Lead-Free
P-Channel
Fast Switching
Fully Avalanche Rated
Surface Mount (I RF5305S)
Advanced Process Technology
175°C Operating Temperature
Low-profile through-hole (IR F5305L)
IRF5305STRRPBF Applications
