Welcome to Hotenda.com Online Store!

logo
userjoin
Home

IPG16N10S461ATMA1

IPG16N10S461ATMA1

IPG16N10S461ATMA1

Infineon Technologies

IPG16N10S461ATMA1 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website

SOT-23

IPG16N10S461ATMA1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-PowerVDFN
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature-55°C~175°C TJ
PackagingTape & Reel (TR)
Published 2011
Series Automotive, AEC-Q101, OptiMOS™
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Terminal Finish Tin (Sn)
Max Power Dissipation29W
Terminal FormFLAT
Reach Compliance Code not_compliant
Pin Count8
JESD-30 Code R-PDSO-F6
Number of Elements 2
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
Operating ModeENHANCEMENT MODE
Case Connection DRAIN
Turn On Delay Time3 ns
Power - Max 29W
FET Type 2 N-Channel (Dual)
Rds On (Max) @ Id, Vgs 61m Ω @ 16A, 10V
Vgs(th) (Max) @ Id 3.5V @ 9μA
Halogen Free Halogen Free
Input Capacitance (Ciss) (Max) @ Vds 490pF @ 25V
Gate Charge (Qg) (Max) @ Vgs 7nC @ 10V
Rise Time1ns
Turn-Off Delay Time 5 ns
Continuous Drain Current (ID) 16A
Gate to Source Voltage (Vgs) 20V
Max Dual Supply Voltage100V
Drain-source On Resistance-Max 0.061Ohm
Pulsed Drain Current-Max (IDM) 64A
Avalanche Energy Rating (Eas) 33 mJ
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Standard
Feedback Cap-Max (Crss) 20 pF
RoHS StatusROHS3 Compliant
Lead Free Contains Lead
In-Stock:5572 items

Pricing & Ordering

QuantityUnit PriceExt. Price

IPG16N10S461ATMA1 Product Details

IPG16N10S461ATMA1 Description


Thanks to innovative production techniques, the Fifth Generation HEXFETs from International Rectifier feature an extraordinarily low on-resistance per silicon area. Thanks to the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, the designer now has a highly reliable and durable device for use in a variety of applications. The footprint area of the new Micro8 package, which is half that of the conventional SO-8, is the smallest of any SOIC design. The Micro8 is the ideal tool because printed circuit board space is limited in many applications. Because of its compact profile, the Micro8 will easily fit into extremely small application environments like portable devices and PCMCIA cards (1.1mm).



IPG16N10S461ATMA1 Features


? Normal Level - Enhancement mode for dual N-channels


? AEC Q101 certification


? MSL1 peak reflow up to 260 ??C



? Operating temperature of 175 ??C



? Eco-Friendly Goods (RoHS compliant)



? Complete avalanche testing



IPG16N10S461ATMA1 Applications


Switching applications


Get Subscriber

Enter Your Email Address, Get the Latest News