FF1800R17IP5PBPSA1 Description
The FF1800R17IP5PBPSA1 is a PrimePACK?3+B-series module with Trench/Fieldstop IGBT5, Emitter Controlled 5 diode and pre-applied Thermal Interface Material. Insulated-gate bipolar transistor, or IGBT, is a type of power semiconductor die. The physical construction and packaging of multiple IGBT power semiconductor dies into a single package is known as an IGBT power module. Normal electrical connections between the dies include half-bridge, 3-level, dual, chopper, booster, etc.
FF1800R17IP5PBPSA1 Features
Electrical Features
Mechanical Features
Package with CTI>400
Pre-applied Thermal Interface Material
High creepage and clearance distances
High power and thermal cycling capability
High power density
FF1800R17IP5PBPSA1 Applications
Traction drives
Wind turbines
High power converters
Motor drives
