DF80R07W1H5FPB11BPSA1 Description
DF80R07W1H5FPB11BPSA1 is an EasyPACK™ module with TRENCHSTOP™ 5 H5 and CoolSiC™ Schottky diode and PressFIT/pre-applied Thermal Interface Material. The DF80R07W1H5FPB11BPSA1 can be applied in Solar applications. The recommended operating temperature is between -40 to 150℃. The package of DF80R07W1H5FPB11BPSA1 is the tray.
DF80R07W1H5FPB11BPSA1 Features
CoolSiCTM Schottky diode gen 5
Increased blocking voltage capability up to 650V
Low inductive design
Low switching losses
Al2O3 substrate with low thermal resistance
Integrated NTC temperature sensor
PressFIT contact technology
Pre-applied Thermal Interface Material
DF80R07W1H5FPB11BPSA1 Applications
Solar applications
Automotive
Body electronics & lighting
Communications equipment
Datacom module
Industrial
Power delivery
