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DF1BUT12EP25RC

DF1BUT12EP25RC

DF1BUT12EP25RC

HIROSEELECTRICCOLTD

DF1BUT12EP25RC datasheet pdf and Backplanes product details from HIROSEELECTRICCOLTD stock available on our website

SOT-23

DF1BUT12EP25RC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 1 day ago)
Lifecycle Status -
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-206AB, TO-46-3 Metal Can
Number of Pins 8
Operating Temperature 0°C ~ 70°C
Packaging Tape & Reel (TR)
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 8
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Regulators
Voltage - Supply 10V ~ 40V
Base Part Number Pmarsl Tmsis
Output Voltage 59 V
Output Type N-Channel
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 1 mA
Nominal Supply Current 1.5 mA
Output Current 60 mA
Max Supply Current 1.5 mA
Slew Rate -
Architecture VOLTAGE-FEEDBACK
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:1073 items

About DF1BUT12EP25RC

The DF1BUT12EP25RC from HIROSEELECTRICCOLTD is a high-performance microcontroller designed for a wide range of embedded applications. This component features DF1BUT12EP25RC datasheet pdf and Backplanes product details from HIROSEELECTRICCOLTD stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the DF1BUT12EP25RC, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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