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M50-3630642

M50-3630642

M50-3630642

Harwin Inc.

CONN HEADER SMD 6POS 1.27MM

SOT-23

M50-3630642 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Contact MaterialBrass
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Polyamide (PA9T), Nylon 9T
Operating Temperature-40°C~105°C
PackagingTube
Series Archer M50
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 6
Number of Rows 1
Fastening TypePush-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Current Rating (Amps) 1A per Contact
Insulation Height 0.039 1.00mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.050 1.27mm
Insulation Color Black
Shrouding Unshrouded
Contact Finish - Post Tin
Contact Length - Mating 0.118 3.00mm
Contact Finish Thickness - Post 100.0μin 2.54μm
Stack Height (Mating) 3.60mm 5.10mm 5.90mm
Material Flammability Rating UL94 V-0
RoHS StatusROHS3 Compliant
In-Stock:12715 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.45000$0.45
76$0.34079$25.90004
152$0.32658$49.64016
532$0.28400$151.088

About M50-3630642

The M50-3630642 from Harwin Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN HEADER SMD 6POS 1.27MM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the M50-3630642, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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