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435-90-220-00-160000

435-90-220-00-160000

435-90-220-00-160000

Mill-Max Manufacturing Corp.

435 Series 2-Row Header Solder Brass Alloy Bulk Through Hole Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT) 20-Position Board to Board 0.050 1.27mm Height

SOT-23

435-90-220-00-160000 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialBrass Alloy
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT)
PackagingBulk
Series 435
JESD-609 Code e0
Pbfree Code no
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
ECCN Code EAR99
Connector Type Header
Number of Positions 20
Number of Rows 2
Additional FeatureLOW PROFILE
HTS Code8536.90.40.00
Fastening TypePush-Pull
Contact Finish - Mating Tin-Lead
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Option GENERAL PURPOSE
Insulation Height 0.050 1.27mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.104 2.64mm
Shrouding Unshrouded
Contact Length - Mating 0.125 3.18mm
Overall Contact Length 0.299 7.60mm
Contact Finish Thickness - Mating 200.0μin 5.08μm
Contact Finish Thickness - Post 200.0μin 5.08μm
RoHS StatusNon-RoHS Compliant
In-Stock:576 items

Pricing & Ordering

QuantityUnit PriceExt. Price
50$12.83220$641.61

435-90-220-00-160000 Product Details

435-90-220-00-160000 Overview


Packaging is in the form of Header.This device has a Through Hole mounting type.An orange Bulk case is used to package the product.Specifically, it is one of the products in the 435 Series.Other features include LOW PROFILE, to name just a few.

435-90-220-00-160000 Features


435 series


435-90-220-00-160000 Applications


There are a lot of Mill-Max Manufacturing Corp.
435-90-220-00-160000 Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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