Name: EPC2106
Brand: EPC
SKU: EPC2106
Price: 1.82000 USD
Availability: InStock

new-10%

EPC2106

Manufacturer part number:EPC2106

Manufacturer:EPC

Description:GANFET TRANS SYM 100V BUMPED DIE

Case Package:SOT-23

Datasheet:EPC2106 Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Factory Lead Time	14 Weeks
Mounting Type	Surface Mount
Package / Case	Die
Supplier Device Package	Die
Operating Temperature	-40°C~150°C TJ
Packaging	Tape & Reel (TR)
Series	eGaN®
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
FET Type	2 N-Channel (Half Bridge)
Rds On (Max) @ Id, Vgs	70mOhm @ 2A, 5V
Vgs(th) (Max) @ Id	2.5V @ 600μA
Input Capacitance (Ciss) (Max) @ Vds	75pF @ 50V
Current - Continuous Drain (Id) @ 25°C	1.7A
Gate Charge (Qg) (Max) @ Vgs	0.73nC @ 5V
Drain to Source Voltage (Vdss)	100V
FET Feature	GaNFET (Gallium Nitride)
RoHS Status	ROHS3 Compliant

About EPC2106

The EPC2106 from EPC is a high-performance microcontroller designed for a wide range of embedded applications. This component features GANFET TRANS SYM 100V BUMPED DIE.

Key Features

Advanced AVR architecture for efficient processing
Wide operating temperature range: -40°C to 85°C
Low power consumption for energy-efficient applications
Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

Industrial control systems
Consumer electronics
Automotive systems
IoT devices
Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EPC2106, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.